3C Industry

3C Industry

Industry Challenges & Machining Pain Points

Semiconductor vacuum chambers, flat-panel display manufacturing stages, and precision automation frames often use large-format aluminum slabs or stainless steel. These components require strict micron-level flatness, precise true position, and pristine O-ring seal finishes. Machining hundreds of fine pneumatic channels, sealing grooves, and multi-angled sensor bores across large plates demands high rotational speeds and dynamically balanced precision.

Gong Yang Solutions & Technical Strengths

Gong Yang’s high-speed angle heads and universal milling heads feature precision dynamic balancing and high-ratio gearing capable of operating reliably at speeds up to 2000+ rpm. They excel at high-speed light milling, small-diameter drilling, rigid tapping, and micro-finishing of seal surfaces. Operating with 360° versatile indexing, these heads allow side-port routing and angled sensor port drilling on chamber sides in a single fixture clamping, eliminating the micron-level distortion caused by re-clamping.

Key Workpiece Applications

Semiconductor vacuum chambers, wafer-handling fixtures, FPD vacuum tables, and high-precision automation structural plates.